31 CFR 850.201

§ 850.201 Advanced packaging.

United States · 31 CFR — Money and Finance: Treasury · Status: effective

Cite this

Citation: 31 CFR 850.201, § 850.201 Advanced packaging, United States, version 1 as recorded 2026-07-09, yourstate.us, https://yourstate.us/provision/144172
Permanent ID: ys:prov:144172@1
SHA-256: 1ec70cfaaa8400eb28f30bc44d070e712e9c20dc064da3fb0a4f9fb2da4c8f97

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Full text

The term advanced packaging means to package integrated circuits in a manner that supports the two-and-one-half-dimensional (2.5D) or three-dimensional (3D) assembly of integrated circuits, such as by directly attaching one or more die or wafer using through-silicon vias, die or wafer bonding, heterogeneous integration, or other advanced methods and materials.

Legislative history

This is a federal regulation, adopted through agency rulemaking under the Administrative Procedure Act — not enacted by a recorded vote of Congress.