31 CFR 850.218
§ 850.218 Package.
United States · 31 CFR — Money and Finance: Treasury · Status: effective
Cite this
- Citation
- 31 CFR 850.218, § 850.218 Package, United States, version 1 as recorded 2026-07-09, yourstate.us, https://yourstate.us/provision/144189
- Permanent ID
ys:prov:144189@1- SHA-256
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Full text
The term package means to assemble various components, such as the integrated circuit die, lead frames, interconnects, and substrate materials to safeguard the semiconductor device and provide electrical connections between different parts of the die.
Legislative history
This is a federal regulation, adopted through agency rulemaking under the Administrative Procedure Act — not enacted by a recorded vote of Congress.